MPI TS2000-SE

Brand: MPI
200 mm Automated Probe System with ShielDEnvironment™

200 mm Automated Probe System with ShielDEnvironment™, for most accurate and reliable DC/CV, RF and mmW measurements

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Product specifications

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Manufacturer MPI
Réf. MPI-TS2000-SE

Product description

The TS2000-SE from MPI is the first ever 200mm automated engineering probe system on the market integrating innovative features specifically designed to reduce the cost of test. These features are incorporated into the MPI ShielDEnvironment™ for ultra-low noise, very accurate and highly reliable DC/CV, RF and High Power measurements.

Designed for Variety of On-Wafer Applications

  • Device Modeling - DC-IV / DC-CV / Pulse-IV
  • RF and mmW - RF Setup from 26 GHz to 110 GHz & beyond
  • Failure Analysis - Probe card / Internode Probing
  • Wafer Level Reliability - Hot / Cold / Long-term test

MPI ShielDEnvironment™ for Accurate Measurements

  • Designed for Advanced EMI / RFI / Light-Tight Shielding
  • fA low-leakage capabilities
  • Ready for temperature range -60 °C to 300 °C
Ergonomic Design and Options
  • Front and advanced automated single wafer side loading capability with easy pre-alignment for automated routines
  • Vertical Control Environment (VCE™) with observation of the probing area from the side for safe operation
  • Integrated active vibration isolation
  • Completely integrated prober control for faster, safer and convenient system and test operation
  • The Safety Test Management (STM™) option to load/unload wafers at any chuck temperatures and auto dew point control                       

featuring:

  • ShielDCap™ - consequent shielding; easy re-configution
  • ShielDEnvironment™ - EMI and light-tight
  • Probe Platen
  • Vertical Controlled Environment™ ( VCE )
  • Modular Chuck
  • RF Calibration
  • Safety Test Management™ (STM) System - reliable testing at different temperatures
  • Active Vibration Isolation
  • Software Suiten Sentio® - assures simple and intuitive operation
  • Microscope and Optics Options
  • Thermal Control
  • Automated single wafer loader - includes pre-alignment for automated routines
  • Hot / cold wafer swaps at set temperatures
  • Integrated Hardware Control Panel