Brand: Tektronix

Application bundle Module


Product specifications

More Information
Manufacturer Tektronix
Bus Decoding CAN/LIN, Flexray, I2C/SPI, I2S/LJ/RJ/TDM, Mask Testing, MIL-STD-1553, RS232/422/485/UART, USB

Product description

MDO3BND - Application bundle Module

Enables all of the functionality of the MDO3AERO, MDO3AUDIO, MDO3AUTO, MDO3COMP, MDO3EMBD, MDO3FLEX, MDO3LMT, MDO3PWR and MDO3USB application modules in a single module. Save money when multiple serial bus debug and analysis application modules are required and easily move the entire set of functionality from one instrument to another.